Fludor paste AG Termopasty Easy Print for SMD soldering is an efficient solution for assembling electronic components,
suitable for both automated processes and manual stencil application. With a Sn62Pb36Ag2 composition, including 62% tin, 36% lead, and 2% silver,
it ensures stable, strong, and reliable solder joints. The No Clean formula simplifies the workflow, as residues do not require cleaning and do not cause corrosion.
The paste is compatible with various reflow soldering methods, offers good adhesion, precise application, and helps reduce the risk of defects,
making it suitable for professional workshops, laboratories, or hobby projects.
Features:
- Composition: Sn62Pb36Ag2
- Content: 62% tin / 36% lead / 2% silver
- Formula: No Clean
- Usage: SMD soldering, manual or automatic application
- Compatibility: laser-cut or electroformed stencils, reflow processes
- Advantages: good adhesion, minimal residues, durable solder joints, no corrosion